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The Plasma System GIGAbatch 360M is a compact high-volume reactor for surface cleaning, hydrophilation, polymer & graphene isotropic etching, polymer activation (e.g., for bonding) and general oxidation on silicon, III/V-compound, quartz, ceramic, lithium niobate substrates.

Specifications:

Feature

Value/Configuration

Process chamber

Ø245 x 395 mm (18 Liters)

Process gas supply

 

MFC 1 gas: O2 (99.999%), 0-2000 sccm.

MFC 2 gas: empty (      ), 0-500sccm. Free slot for He, Ar, N2, CF4, etc.

Vent gas supply

VENT gas: N2 (99.999%), 0.5-1 bar.

Microwave generator

 

Power output: up to 1000 Watt

Frequency: 2.45 GHz

Coupling: Parabolic antenna

Vacuum system

Base pressure: < 0.1 mbar

Operating pressure: 0.6 – 1.5 mbar

Pump down time: typically, 1 min.

Valve: DN 40 KF Elbow type

Vacuum pump

Name: Edwards GX100N (located in ISSP’s basement)

Type: Dry pump

Pumping speed: up to 105 m3/h

Ultimate pressure: 5x10-3 mbar

Plasma system control

Plasma system gas valves are powered by compressed dry air (CDA) 4-6 bar. PC based system controller with 10.4” TFT color monitor, USB, Ethernet, RS232.

Process control

 

Chamber temperature monitor: IR sensor.

Plasma control: optical emission End Point Detection with plasma verification & vacuum set point as microwave interlock.

Sample holders

Horizontal quartz plate: 350x130x4 mm.

Quartz boat for 4” & 6” wafers, 27 slots.

Other accessories

Faraday cage.

Tool name:
Plasma Asher
Area/room:
CLR - 116
Category:
Cleaning and surface preparation
Manufacturer:
PVA TePla AG
Model:
GIGAbatch 360M
Tool rate:
A

Instructors

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