Picture of HMDS prime oven
Current status:
AVAILABLE
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HMDS (hexamethyldisilizane) surface priming enhance adhesion of photoresist. In addition to proper adhesion, surface moisture is also a major factor that also could degrade resist adhesion and could result in resist pattern peeling off or unwanted lateral etching through the cracks under the resist

Wafer size: up to 200 mm

Operation temperature: ambient to 160o C.

Available cassettes:

  • 50 mm/ 2"
  • 100 mm/ 4"
  • 150 mm/ 6"

 

 

 

 

Tool name:
HMDS prime oven
Area/room:
CLR - 116
Category:
Cleaning and surface preparation
Manufacturer:
Yield Engineering Systems
Model:
YES-310TAE
Tool rate:
A
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:

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