HMDS (hexamethyldisilizane) surface priming enhance adhesion of photoresist. In addition to proper adhesion, surface moisture is also a major factor that also could degrade resist adhesion and could result in resist pattern peeling off or unwanted lateral etching through the cracks under the resist
Wafer size: up to 200 mm
Operation temperature: ambient to 160o C.
- 50 mm/ 2"
- 100 mm/ 4"
- 150 mm/ 6"