Picture of PECVD PlasmaPro 100
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Common application: High rate plasma enhanced chemical vapor deposition of uniform SiOx and SiNx thin films.

Available gases: N2O, CF4, Ar, N2, NH3, 2% SiH4/Ar.

Wide temperature range electrode.

Compatible with all wafer sizes up to 200 mm.

In-situ chamber cleaning and end-pointing.

Tool name:
PECVD PlasmaPro 100
Area/room:
CLR - 120
Category:
Thin film deposition
Manufacturer:
Oxford Instruments
Model:
PlasmaPro 100 PECVD
Tool rate:
A

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