Manual universal thin wire bonder 53XX BDA. It has built-in motorized Y-axis is fully programmable and produces an entire bond loop, complete with programmable tear-off function and tail definition.
Two bond processes:
- ball-wedge bonding
- wedge-wedge bonding
Wire 17.5-50 μm.
Bonde force programmable 5-300 cN
- step by step
- semi-auto production mode
Loop Types: triangular, rectangular, reverse, stitch, all programmable.
- Z axis 60 mm, 1 μm resolution
- Y axis 25 mm, 2 μm resolution
Substrate holder: 95 mm Ø, vacuum and mechanical clamping, 200o C