The Plasma System GIGAbatch 360M is a compact high-volume reactor for surface cleaning, hydrophilation, polymer & graphene isotropic etching, polymer activation (e.g., for bonding) and general oxidation on silicon, III/V-compound, quartz, ceramic, lithium niobate substrates.
Specifications:
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Feature
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Value/Configuration
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Process chamber
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Ø245 x 395 mm (18 Liters)
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Process gas supply
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MFC 1 gas: O2 (99.999%), 0-2000 sccm.
MFC 2 gas: empty ( ), 0-500sccm. Free slot for He, Ar, N2, CF4, etc.
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Vent gas supply
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VENT gas: N2 (99.999%), 0.5-1 bar.
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Microwave generator
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Power output: up to 1000 Watt
Frequency: 2.45 GHz
Coupling: Parabolic antenna
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Vacuum system
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Base pressure: < 0.1 mbar
Operating pressure: 0.6 – 1.5 mbar
Pump down time: typically, 1 min.
Valve: DN 40 KF Elbow type
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Vacuum pump
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Name: Edwards GX100N (located in ISSP’s basement)
Type: Dry pump
Pumping speed: up to 105 m3/h
Ultimate pressure: 5x10-3 mbar
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Plasma system control
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Plasma system gas valves are powered by compressed dry air (CDA) 4-6 bar. PC based system controller with 10.4” TFT color monitor, USB, Ethernet, RS232.
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Process control
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Chamber temperature monitor: IR sensor.
Plasma control: optical emission End Point Detection with plasma verification & vacuum set point as microwave interlock.
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Sample holders
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Horizontal quartz plate: 350x130x4 mm.
Quartz boat for 4” & 6” wafers, 27 slots.
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Other accessories
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Faraday cage.
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