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Current status:
AVAILABLE
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The GIGAbatch 360 M is a compact reactor for resist removal and substrate cleaning. 

Applications:

  • Wafer and substrate cleaning;
  • Removal of photoresist after high dose implant or dry etching;
  • Suitable for various substrate technologies like silicon, III/V-compounds, quartz, ceramic, lithium niobate, copper interconnect devices, etc.

Technical data:

  • Wafer Size: up to 150 mm
  • Sample loading: Manual
  • Plasma Generation: Microwave source (2.45 GHz), max. 1000 W
  • Process gases: Oxygen
  • Plasma verification & process End Point Detection: optical emission
  • Temperature control: IR sensor
Tool name:
Plasma Asher
Area/room:
CLR - 116
Category:
Cleaning and surface preparation
Manufacturer:
PVA TePla AG
Model:
GIGAbatch 360M
Tool rate:
A

Standard recipes:
(do not edit them!)

0_preclean_Si&glass
Removes organic dirt from Si & glass (without Faraday cage). High efficiency.
Eg.: after IPA, Acetone, eg. prior to HMDS. Small batch size.

0_preclean_faraday
Removes organic dirt  (eg. after IPA, Acetone, eg. prior to HMDS) using Faraday cage to protect samples from ion bombardment & heating. (UV+oxidation only, no plasma contact). Without temp. control. Small batch size.

0_preclean_III-V
Removes organic dirt  (eg. after IPA, Acetone, eg. prior to HMDS) using Faraday cage to protect III-V compounds from ion bombardment & heating. (UV+oxidation only, no plasma contact).
Temperature controlled process. Small batch size.

0_strip_any_III-V_5psc
Stripping photoresist using Faraday cage to protect III-V coatings from ion bombardment & heating. (UV+oxidation only, no plasma contact).
Temperature controlled process. Small batch size.

0_strip_neg500nm_Si_5psc
Stripping negative photoresist from silicon, glass, ceramic coatings. Small batch.
Low efficiency process. Some resists require Cl- or F- chemistry for etching. This can be done using RIE Oxford PP 100 Cobra (1200018).

0_strip_pos100nm_Si_5psc
Stripping positive photoresist residuals, removal after wet photoresist stripping from silicon, glass, ceramic coatings.  Small batch.

0_strip_pos500nm_Si_5psc
Stripping 500nm positive photoresist from silicon, glass, ceramic coatings. Small batch.

0_strip_pos1500nm_Si_5psc
Stripping 1,5um positive photoresist from silicon, glass, ceramic coatings. Small batch.

0_descum_si_5psc
Removes organic dirt out of trenches. Small batch.

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