Common cutting applications: ceramics, glass, silicon, GaAs, InP
Maximal cutting length / width: 200 mm / 100 mm
Angle adjustment via micrometer: min. resolution – 0.006°, max. resolution - 4°
X-axis and Y-axis maximal range ≤ 240 mm
Substrate thickness ≤ 10 mm
4 diamond cutting edges
Monocular microscope with reticle (100 increments): 40X, LED illumination
Adjustable touch-down/lift up diamond tool Y position setting scribing length
Rotating vacuum chuck for maximum 1 x 200 mm wafer
Adjustable mounting positions to vary scribing angle: 60±7°
Scribing force: 5-581 cN